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TI Ref No : 528440252
Description : Supply Of 8 Swg (4.064 Mm Diameter) Insulated Wire For Track Circuit Bonding, Adhering To Is:279/81 Specifications. Wire I.g. 8 Swg (4.064 Mm Dia)
Date : 2026-02-05
Deadline : 2026-02-11
Document Type : Tenders
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