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| TI Ref No : | 519093093 |
|---|---|
| Description : | Tender Invited For (w9703890102) Solder Wire, Wire Dia: 0.5-0.8 Mm, Composition: Tin: 99.3% , Copper: 0.7% , 100 Gram , (w97055001030) Adhesive Copper Tape (copper Foil Tape) , Electrically Conductive , (w97055002010) Highly Conductive Silver Loaded Two P |
| Date : | 2025-06-13 |
| Deadline : | 2025-06-21 |
| Document Type : | Tenders |
