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TI Ref No : | 505630789 |
---|---|
Description : | Tech Licensing Opportunity: Advanced Bonding Method For Heterogeneous Systems |
Date : | 2024-07-02 |
Deadline : | 2024-12-29 |
Document Type : | Tenders |
TI Ref No : | 505630789 |
---|---|
Description : | Tech Licensing Opportunity: Advanced Bonding Method For Heterogeneous Systems |
Date : | 2024-07-02 |
Deadline : | 2024-12-29 |
Document Type : | Tenders |