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TI Ref No : | 522407340 |
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Description : | Plasma Enhanced Chemical Vapour Deposition Tool For Automated Uniform Layer Film Deposition. The System Should Have Specifications For The Deposition Of Sio2 And Sin, Including An Aluminium Process Chamber, Pumping Flange, Viewport, Substrate Electrodes, |
Date : | 2025-09-04 |
Deadline : | 2025-09-23 |
Document Type : | Tenders |