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| TI Ref No : | 519611876 |
|---|---|
| Description : | Contract Awarded For Nantong Kangyuan Integrated Circuit Packaging Substrate Project (phase I)-needle Probe Testing Machine 1 Set nantong Kangyuan Integrated Circuit Packaging Substrate Project (phase I)-needle Probe Testing Machine 1 Set Nantong Hong Yu |
| Date : | 2025-06-25 |
| Deadline : | 2025-09-24 |
| Document Type : | Contracts |
