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| TI Ref No : | 519089393 |
|---|---|
| Description : | Contract Awarded For Six Automatic Module Bonding Devices yixing Crrc Times Semiconductor Co., Ltd. Automatic Module Bonding Equipment Procurement Project (re-bidding) Yixing Crrc Times Semiconductor Co., Ltd. 2025-06-04 09:30 2025-06-06 17:30 - 2025-06- |
| Date : | 2025-06-12 |
| Deadline : | 2025-09-12 |
| Document Type : | Contracts |
