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| TI Ref No : | 519087900 |
|---|---|
| Description : | Contract Awarded For Three Aluminum Wire Bonding Devices Three Liner Plate Bonding Devices One Set Of Copper Wire Bonding Equipment zhuzhou Crrc Times Semiconductor Co., Ltd. Bonding Equipment Procurement Project (re-bidding) Zhuzhou Crrc Times Semicondu |
| Date : | 2025-06-12 |
| Deadline : | 2025-09-12 |
| Document Type : | Contracts |
