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| TI Ref No : | 518206483 |
|---|---|
| Description : | Contract Awarded For Module Bonding Inspection And Module Pcb Bonding And Module Pcb Bonding Inspection And Re-work Ic&pcb Bonding And Module Driver Ic Bonding chuzhou Hkc Optoelectronics Technology Co., Ltd. Module Bonding Inspection And Module Pcb Bond |
| Date : | 2025-05-22 |
| Deadline : | 2025-08-19 |
| Document Type : | Contracts |
