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| TI Ref No : | 517230868 |
|---|---|
| Description : | Tender Invited For 2103671048 Thermal Pad 18x18, 2103671045 Thermal Pad 56x42 150gr-m, 2103671039 Pad 12x 93, 2103671044 Pad Capacitors, 7432411119 Rfi Gasket, 7441123401 Gap Fill 50 Gr-d 121x163 Mm, 7441123402 Gap Fill 50 Gr-d 117x62 Mm qty:2667 |
| Date : | 2025-04-24 |
| Deadline : | 2025-05-15 |
| Document Type : | Tenders |
