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| TI Ref No : | 515981919 |
|---|---|
| Description : | Contract Awarded For Item Number2,item Name:3d Automatic Profiler,quantity:1 Unit,main Technical Data:wafer Size:12",wafer Thickness:400~1000um,remarks:not Have. hotchip Semiconductor Co.,ltd. To Purchase 1 Set Of 3d Inspection Machine And 1 Set Of 3d Au |
| Date : | 2025-03-19 |
| Deadline : | 2025-06-18 |
| Document Type : | Contracts |
